Wafer Level 3-D Ics Process Technology


  • Tytuł: Wafer Level 3-D Ics Process Technology
  • Autor: C. Tan
  • Wydawnictwo: Springer Verlag
  • Data wydania: 2008
  • Słowa kluczowe:
  • Kategorie: elektryka i elektronika / electrics & electronics
  • ISBN: 978-0-387-76532-7
  • Opis: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. TOC:Overview of Wafer Level 3-D ICs.- Monolithic 3-D Integrated Circuits.- Stacked CMOS Technologies.- Wafer Bonding Technologies and Strategies for 3-D ICs.- Through Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies.- Cu Wafer Bonding for 3-D ICs Applications.- Cu/Sn Solid-Liquid Interdiffusion Bonding.- An SOI-Based 3-D Circuit Integration Technology.- 3-D Fabrication Options for High Performance CMOS Technology.- 3-D Integration Based upon Dielectric Adhesive Bonding.- Direct Hybrid Bonding.- 3-D Memory.- Circuit Architectures for 3-D Integration.- Thermal Challenges of 3-D ICs.- Status and Outlook.

    • Kup książkę: Wafer Level 3-D Ics Process Technology


    Wafer Level 3-D Ics Process Technology - C. Tan

    Zobacz również: książki zagraniczne z kategorii elektryka i elektronika / electrics & electronics w serwisie Boston Books