Solder Joint Technology


  • Tytuł: Solder Joint Technology
  • Autor: K. Tu
  • Wydawnictwo: Springer Verlag
  • Data wydania: 2007
  • Słowa kluczowe:
  • Kategorie: technologia / technology
  • ISBN: 978-0-387-38890-8
  • Opis: Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. TOC:Introduction.- Cu-Sn reaction in bulk samples.- Cu-Sn reaction in thin film samples. Cu-Sn reaction in flip chip solder joints and electromigration.- Kinetic analysis of flux-driven ripening of Cu-Sn scallops.- Polarity effect of electromigration on solder reactions.- Ductile-to-brittle transition of solder joints affected by Cu-Sn reactions.- Spontaneous Sn whisker growth on Cu leadframe finished with Pb-free.- Comparison to solder reactions on other metals.

    • Kup książkę: Solder Joint Technology


    Solder Joint Technology - K. Tu

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